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  • KOH YOUNG TECHNOLOGIES – KY-8030L (2006) [ORIGINAL HIDDEN]

KOH YOUNG TECHNOLOGIES – KY-8030L (2006) [ORIGINAL HIDDEN]

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SKU: SPI-8L04

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Solder Paste Inspection (SPI)

The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of
solder paste.
Detect all defects including insufficient and excessive deposits, shape deformation, missing paste, paste offset, smearing, bridging and more.
Max. PCB Size: 510 x 510 mm 20.08 x 20.08 inch
Min. PCB Size: 50 x 50 mm 1.97 x 1.97 inch
PCB Thickness: 0.4 ~ 5.0 mm 0.016 ~ 0.20 inch
Max. PCB Weight: 2.0 kg 4.4 lbs
Machine Weight: 550 kg 1210 lbs
Bottom Side Clearance:2 5.4 mm 1.0 inch
Electrical Supply: 220 VAC, 50/60 Hz Single phase
Air Supply: 5Kgf/cm²
#1389
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